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山東齊芯微(wei)系(xi)統(tong)(tong)科技(ji)有限公(gong)司公(gong)司成(cheng)(cheng)立于2011年(nian)元月，位(wei)于山東省(sheng)淄(zi)博市(shi)國家(jia)高新(xin)技(ji)術產業(ye)開發(fa)區，主要業(ye)務為集成(cheng)(cheng)電(dian)路（IC）芯片及微(wei)系(xi)統(tong)(tong)（MEMS）器件(jian)的設(she)計(ji)、加工(gong)(gong)及封(feng)裝測試；智能(neng)物聯及倉儲整(zheng)體解決(jue)方案提供商。公(gong)司占地面積60畝，引進了當今國際集成(cheng)(cheng)電(dian)路及MEMS加工(gong)(gong)設(she)備，年(nian)IC芯片封(feng)裝測試能(neng)力(li)為20億(yi)個(ge)(ge)(ge)， MEMS器件(jian)加工(gong)(gong)能(neng)力(li)為1000萬個(ge)(ge)(ge)以上，。公(gong)司連(lian)續三(san)年(nian)被評為淄(zi)博創新(xin)50強(qiang)企業(ye)，連(lian)續多年(nian)被評為高新(xin)區工(gong)(gong)業(ye)三(san)十強(qiang)企業(ye)，為高新(xin)技(ji)術企業(ye)，擁有1個(ge)(ge)(ge)省(sheng)級研發(fa)平臺，2個(ge)(ge)(ge)市(shi)級研發(fa)平臺，2017年(nian)掛牌新(xin)三(san)板，正在進行(xing)創業(ye)板的IPO工(gong)(gong)作(zuo)

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公(gong)司投(tou)資建(jian)(jian)設(she)新項(xiang)目(mu)(mu)：晶(jing)圓(yuan)級芯片(pian)(pian)封(feng)(feng)(feng)裝及倒(dao)貼片(pian)(pian)項(xiang)目(mu)(mu)。總投(tou)資80億元，該項(xiang)目(mu)(mu)采用國際先(xian)進的(de)(de)芯片(pian)(pian)尺寸封(feng)(feng)(feng)裝（CSP）和晶(jing)圓(yuan)級封(feng)(feng)(feng)裝（WLP）融合(he)為(wei)一(yi)體的(de)(de)新興封(feng)(feng)(feng)裝技(ji)術，將(jiang)IC設(she)計、晶(jing)圓(yuan)制造、封(feng)(feng)(feng)裝測試、基板廠(chang)整合(he)為(wei)一(yi)體，相比傳統(tong)的(de)(de)單芯片(pian)(pian)封(feng)(feng)(feng)裝在技(ji)術、成(cheng)(cheng)(cheng)(cheng)本和市場應用上有(you)突破性優勢。該項(xiang)目(mu)(mu)建(jian)(jian)成(cheng)(cheng)(cheng)(cheng)后將(jiang)使公(gong)司成(cheng)(cheng)(cheng)(cheng)為(wei)國內為(wei)數(shu)不多的(de)(de)具備國際領先(xian)水平(ping)的(de)(de)集成(cheng)(cheng)(cheng)(cheng)電路封(feng)(feng)(feng)裝企(qi)業。項(xiang)目(mu)(mu)一(yi)期(qi)投(tou)資5億元，達(da)到年20片(pian)(pian)的(de)(de)先(xian)進封(feng)(feng)(feng)裝能力，一(yi)期(qi)項(xiang)目(mu)(mu)已經完成(cheng)(cheng)(cheng)(cheng)前期(qi)建(jian)(jian)設(she)，2021年計劃投(tou)產。