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一(yi)般(ban)項目(mu)：半導體(ti)(ti)(ti)器(qi)(qi)件(jian)(jian)(jian)專(zhuan)用設(she)備(bei)制(zhi)造(zao)(zao)；半導體(ti)(ti)(ti)器(qi)(qi)件(jian)(jian)(jian)專(zhuan)用設(she)備(bei)銷(xiao)售(shou)；金(jin)屬(shu)(shu)包裝(zhuang)(zhuang)容(rong)器(qi)(qi)及(ji)(ji)(ji)材料(liao)(liao)制(zhi)造(zao)(zao)；金(jin)屬(shu)(shu)包裝(zhuang)(zhuang)容(rong)器(qi)(qi)及(ji)(ji)(ji)材料(liao)(liao)銷(xiao)售(shou)；塑料(liao)(liao)包裝(zhuang)(zhuang)箱及(ji)(ji)(ji)容(rong)器(qi)(qi)制(zhi)造(zao)(zao)；塑料(liao)(liao)制(zhi)品(pin)銷(xiao)售(shou)；電(dian)子(zi)專(zhuan)用材料(liao)(liao)制(zhi)造(zao)(zao)；電(dian)子(zi)專(zhuan)用材料(liao)(liao)銷(xiao)售(shou)；電(dian)子(zi)元器(qi)(qi)件(jian)(jian)(jian)制(zhi)造(zao)(zao)；集(ji)成電(dian)路芯片(pian)及(ji)(ji)(ji)產品(pin)制(zhi)造(zao)(zao)；電(dian)子(zi)元器(qi)(qi)件(jian)(jian)(jian)批發；電(dian)子(zi)元器(qi)(qi)件(jian)(jian)(jian)零售(shou)；集(ji)成電(dian)路芯片(pian)及(ji)(ji)(ji)產品(pin)銷(xiao)售(shou)；工(gong)程(cheng)和技(ji)(ji)術(shu)研究和試驗發展；技(ji)(ji)術(shu)服(fu)務、技(ji)(ji)術(shu)開發、技(ji)(ji)術(shu)咨詢(xun)、技(ji)(ji)術(shu)交流、技(ji)(ji)術(shu)轉讓(rang)、技(ji)(ji)術(shu)推(tui)廣；特(te)種設(she)備(bei)銷(xiao)售(shou)；晶圓盒制(zhi)造(zao)(zao)、銷(xiao)售(shou)（除依(yi)法(fa)須經(jing)(jing)(jing)批準的項目(mu)外，憑營(ying)業執照依(yi)法(fa)自主開展經(jing)(jing)(jing)營(ying)活(huo)動）許可項目(mu)：特(te)種設(she)備(bei)制(zhi)造(zao)(zao)；貨物進(jin)出口；技(ji)(ji)術(shu)進(jin)出口（依(yi)法(fa)須經(jing)(jing)(jing)批準的項目(mu)，經(jing)(jing)(jing)相關部門批準后方可開展經(jing)(jing)(jing)營(ying)活(huo)動，具體(ti)(ti)(ti)經(jing)(jing)(jing)營(ying)項目(mu)以(yi)審批結果為準）